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AMD EPYC 7313 processor 3 GHz 128 MB L3 Box
AMD

AMD EPYC 7313 processor 3 GHz 128 MB L3 Box

Part number: 100-100000329WOF
$989.58

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16 cores, 32 threads, 3GHz base clock, 3.7GHz boost clock, 128MB L3 cache, 155W TDP

Description

Nothing Stacks Up to EPYC
Meet the AMD EPYC™ server processor family

Transform Your Data Center from Standard to Standout
Elevate performance, boost energy efficiency, and prepare for AI-driven innovation by modernizing your data center with AMD EPYC™ processors. You Decide What’s Inside.

Broad Ecosystem Support
Find industry-leading enterprise data center and AI solutions from our partners.

Count on seamless integration with the AMD comprehensive data center portfolio. AMD offers a full, mature portfolio of data center hardware and software solutions, including all-purpose CPUs for on-premises, cloud, and AI demands; a premier line of GPUs for AI, and Robust, interoperable networking solutions.

AMD collaborates with a broad network of solution providers to help ensure your applications run exceptionally well. With AMD EPYC, you can experience worry-free migration and seamless integration with existing x86 infrastructures.

Specifications

Processor
Processor base frequency 3 GHz
Processor manufacturer AMD
Cooler included No
Configurable TDP-down 155 W
Thermal Design Power (TDP) 155 W
Processor cache 128 MB
Processor model 7313
Processor threads 32
Processor operating modes 32-bit, 64-bit
Processor boost frequency 3.7 GHz
Component for Server/workstation
Processor lithography 7 nm
Processor family AMD EPYC
Processor cores 16
Processor socket Socket SP3
Configurable TDP-up 180 W
Processor cache type L3
Generation Zen 2
Package type Box
Memory
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 3200 MHz
Memory channels Octa-channel
Memory bandwidth (max) 204.8 GB/s
Graphics
Discrete graphics card No
On-board graphics card model Not available
On-board graphics card No
Discrete graphics card model Not available
Power
Configurable TDP-down 155 W
Thermal Design Power (TDP) 155 W
Technical details
PCI Express slots version 4.0
Thermal Design Power (TDP) 155 W
Market segment Server
Configurable TDP-up 180 W
Processor cache type L3
Features
Maximum number of PCI Express lanes 128
Thermal Design Power (TDP) 155 W
PCI Express slots version 4.0
Market segment Server
Harmonized System (HS) code 85423119
Processor special features
Configurable TDP-up 180 W
Packaging data
Package type Box
Logistics data
Harmonized System (HS) code 85423119

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