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Cisco Intel Xeon Platinum 8368 processor 2.4 GHz 57 MB Tray
Cisco

Cisco Intel Xeon Platinum 8368 processor 2.4 GHz 57 MB Tray

Part number: HX-CPU-I8368
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Intel Xeon Platinum 8368 Processor 57M Cache, 2.40 GHz, for P/N: HX220C-M6S, HX220C-M6S=, HX240C-M6L=, HX240C-M6SX=, HXAF220C-M6SN=, HXAF240C-M6SN=

Description

The Xeon® Processor from Cisco is designed to deliver enhanced reliability and flexibility for server platforms. This processor offers excellent performance and headroom for peak Internet server loads, resulting in faster response times, support for more users and improved scalability.

Specifications

Processor
Processor generation 3rd Generation Intel® Xeon® Scalable
Processor base frequency 2.4 GHz
Processor manufacturer Intel
Cooler included No
Processor codename Ice Lake
Thermal Design Power (TDP) 270 W
Processor cache 57 MB
Processor ARK ID 212455
Processor model 8368
Processor threads 76
System bus rate 11.2 GT/s
Processor operating modes 64-bit
Processor boost frequency 3.4 GHz
Component for Server/workstation
Processor lithography 10 nm
Processor family Intel® Xeon® Platinum
Processor cores 38
Processor socket LGA 4189
Package type Tray
High priority cores 16
High priority core frequency 2.5 GHz
Low priority cores 22
Low priority core frequency 2.3 GHz
Memory
Maximum internal memory supported by processor 6.14 TB
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 3200 MHz
Supported memory types DDR4-SDRAM
Memory channels Octa-channel
ECC Yes
Graphics
Discrete graphics card No
On-board graphics card model Not available
On-board graphics card No
Discrete graphics card model Not available
Power
Thermal Design Power (TDP) 270 W
Technical details
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Execute Disable Bit Yes
PCI Express slots version 4.0
Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512
Scalability 2S
Intel VT-x with Extended Page Tables (EPT) Yes
Embedded options available No
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Thermal Design Power (TDP) 270 W
Supported memory types DDR4-SDRAM
Status Launched
Market segment Server
Launch date Q2'21
Intel Virtualization Technology (VT-x) Yes
Number of UPI links 3
Memory speed (max) 3200 MHz
AVX-512 Fused Multiply-Add (FMA) units 2
Target market High Performance Computing
Servicing status Baseline Servicing
Features
Maximum number of PCI Express lanes 64
Thermal Design Power (TDP) 270 W
Processor package size 77.5 x 56.5 mm
Processor ARK ID 212455
Execute Disable Bit Yes
PCI Express slots version 4.0
Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512
Scalability 2S
Embedded options available No
Market segment Server
Harmonized System (HS) code 85423119
Export Control Classification Number (ECCN) 5A992CN3
Commodity Classification Automated Tracking System (CCATS) G178966
Processor special features
Intel Software Guard Extensions (Intel SGX) Yes
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Intel® Speed Shift Technology Yes
Intel® Optane™ Memory Ready Yes
Intel® Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Intel VT-x with Extended Page Tables (EPT) Yes
Intel Virtualization Technology (VT-x) Yes
AVX-512 Fused Multiply-Add (FMA) units 2
Intel® Volume Management Device (VMD) Yes
Intel® Optane™ DC Persistent Memory Supported Yes
Intel® Deep Learning Boost (Intel® DL Boost) on CPU Yes
Mode-based Execute Control (MBE) Yes
Intel® Run Sure Technology Yes
Intel® Resource Director Technology (Intel® RDT) Yes
Intel® Transactional Synchronization Extensions Yes
Intel® Total Memory Encryption Yes
Maximum Enclave Size Support for Intel® SGX 512 GB
Intel® Platform Firmware Resilience Support Yes
Intel® Crypto Acceleration Yes
Operational conditions
Tcase 84 °C
Packaging data
Package type Tray
Logistics data
Harmonized System (HS) code 85423119
Weight & dimensions
Processor package size 77.5 x 56.5 mm
Other features
Maximum internal memory 6 TB

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