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AMD Opteron Dual-core 8222 SE processor 3 GHz 1 MB L2 Tray
AMD

AMD Opteron Dual-core 8222 SE processor 3 GHz 1 MB L2 Tray

Part number: OSY8222GAA6CY
$1,676.48

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Opteron Dual-core 8222 SE, 3.0GHz, tray, Socket F (1207), L2 Cache 1MB

Description

The AMD Opteron™ processor helps enable a breakthrough in high-performance, low power processing for edge-of-enterprise markets including storage and telecommunications, as well as more traditional embedded markets such as security and medical imaging, military systems, and single-board computing. AMD64 technology with Direct Connect Architecture helps provide a balanced foundation for embedded systems. Based on the industry-standard x86 platform, AMD64 delivers the right match of processing power, memory performance, I/O throughput, and scalability. Add the vision of 32- and 64-bit application support with native multi-core computing in a consistent thermal envelope and many embedded designers are finding their AMD Opteron™ processor-based next-generation systems deliver superior application performance.

- HyperTransport™ technology provides up to 17.6GB/s per link in HT 3.0 generation, and is compatible with HT 1.0 generation implementation.
- On-die integrated DDR2 memory controller offers available memory bandwidth up to 12.8GB/s (with DDR2-800) per processor.
- Hardware assisted AMD Virtualization™ technology in AMD Opteron processors with DDR2 helps streamline the efficiency of multiple servers and provides virtual machine memory isolation for improved security.
- Socket F (1207) provides system upgrade option from dualcore to quad-core in the same physical foorprint with future upgrade to six-core when they become available.

Specifications

Processor
Processor base frequency 3 GHz
Processor manufacturer AMD
Thermal Design Power (TDP) 119 W
Processor cache 1 MB
Processor operating modes 64-bit
L1 cache 0.125 MB
Stepping F3
L2 cache speed 3 GHz
Processor core voltage (AC) 1.325/1.375 V
Processor lithography 90 nm
Processor family AMD Opteron
Processor front side bus 1000 MHz
Processor cores 2
Processor socket Socket F (1207)
Processor cache type L2
Package type Tray
Power
Thermal Design Power (TDP) 119 W
Processor core voltage (AC) 1.325/1.375 V
Technical details
L2 cache speed 3 GHz
Thermal Design Power (TDP) 119 W
Processor cache type L2
Features
Thermal Design Power (TDP) 119 W
Operational conditions
Maximum operating temperature 69 °C
Packaging data
Package type Tray
Other features
L1 cache 0.125 MB

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